Diligence memo · auto-generated · as of July 2, 2026

Teledyne Technologies Inc

Teledyne Technologies Inc looks over-valued against its niche peers and is dormant on financing cadence.

DeprioritizeFinancing has gone silent well past the sector's normal cadence — treat as inactive until outside confirmation of a live operation.

Businessfiled

Teledyne Technologies Inc operates in Manufacturing, based in Thousand Oaks.

No verified homepage on file yet — operating evidence is limited to the public record.

Capital & rounds (filed)filed

Teledyne Technologies Inc has raised $250M in disclosed capital across 1 recorded round, aggregated from public filings. Its latest round is modeled as Series D+ (a $100M–$400M round).

Largest single filing: $250M on 2010-05-12.

Most recent recorded round closed around 2010-05-12.

Valuation (modeled)modeled

Provath models Teledyne Technologies Inc at approximately $2.8B (range $1.4B–$6.2B). This is an algorithmic estimate from round sizes and same-niche peers — not a quoted or reported figure.

Read: Over-valued. Modeled value is 1.76× the median modeled value of Series D+ Manufacturing companies in 2010–2012 (16 peers) — value vs value, same stage and era.

Financing rhythm & timingmixed

Last raise 16.1 yr ago; this sector typically re-raises about every 12 months.

Only one round on record and long silent — often defunct, acquired, or gone quiet.

Comparablesmixed

Capital scale ranks ahead of 98% of Manufacturing peers (3257 compared).

Modeled value ranks above 99% of those peers.

Closest niche peers: Picasso Parent Company, Inc., Mcron Acquisition Corp., IHC Holding Corp., Thermadyne Technologies Holdings, Inc., Alpha Packaging LLC.

Peoplefiled

12 named people on file across officers, directors and signatories.

Risks & flagsmixed

Financing has been silent well beyond sector cadence — possibly defunct, acquired, or paused.

Modeled above niche peers — valuation risk on entry.

No clearly named CEO/founder/principal in the surfaced records — key-person evidence is thin.